| abstract |
The present invention provides the steps of supplying a substrate including a surface to be coated to a low-pressure reaction chamber, exposing the surface to plasma during a treatment period in the reaction chamber, and ensuring stable plasma ignition by applying a power input. It relates to a method comprising a, the power input is continuously strictly higher than 0 watts (W) during the processing period, at least one lower threshold power, and at least one upper threshold power strictly greater than the lower threshold power. And thus, it is possible to obtain a substrate having a coated surface. The invention also relates to an apparatus for treating a substrate with a low pressure plasma process, and to a substrate so treated. |