| abstract |
A silicon-containing polymer (A) containing the following bonds (a), (b), (c) and (d), a cyanate ester compound (B), an epoxy resin (D), and a filler (E). Resin composition for printed wiring boards. (In bonds (a) to (d), R is selected from a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms. X represents a monovalent organic group containing an epoxy group. The silicon-containing polymer (A) All of R and X in all may be the same or different.) |