| abstract |
The present invention relates to a thermally conductive adhesive film using a carbon-based filler, and specifically, to a thermally conductive polymer composite composition including an acrylic resin, alumina and a carbon material, and a thermally conductive adhesive, film and tape including the same. The thermally conductive polymer composite composition according to the present invention has an effect of improving heat dissipation properties (vertical thermal conductivity) by mixing acrylic resin, alumina, and carbon materials at a specific mixing ratio, and in particular, only a small amount of carbon materials is used. Accordingly, there is an effect of exhibiting excellent heat conduction characteristics while having remarkably low electrical conductivity. |