| abstract |
Provided herein is a conductive ink composition having a good balance between adhesion to a substrate, stability of submicron size particles, ability to sinter at relatively low temperatures, and good electrical conductivity. In one aspect, a conductive network made from a composition according to the invention is provided. In certain aspects, such conductive networks are suitable for use in touch panel displays. In certain aspects, the present invention relates to a method of adhering submicron silver particles to a non-metallic substrate. In certain aspects, the present invention relates to a method of improving the adhesion of a submicron silver-filled composition to a non-metallic substrate. |