| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03462
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-022 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1689
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2015-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2020-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102169555-B1 |
| titleOfInvention |
Electroplating methods for semiconductor substrates |
| abstract |
In order to provide a more uniform metal film on the substrate, the non-uniform initial metal film is unevenly deplated. Electrochemical deplating can be performed by placing the substrate in a deplating bath specially formulated for deplating rather than plating. The deplating bath may have a throwing power of 0.3 or less, or a bath conductivity of 1 mS/cm to 250 mS/cm. The reverse current conducted through the deplating bath unevenly electrolytically etches or deplates the metal film. |
| priorityDate |
2014-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |