| abstract |
To provide an epoxy compound having a low melt viscosity and excellent heat resistance and flame retardancy in a cured product, an epoxy resin containing the same, a curable composition and a cured product thereof, and a semiconductor encapsulating material. The following general formula (I) [In the formula, G represents a glycidyl group, and X represents the following structural formula (x1) or (x2) (In formula (x1) or (x2), k is an integer of 1 to 3, m is 1 or 2, Ar is the following structural formula (Ar1) or (Ar2) (In formula (3) or (4), G represents a glycidyl group, p and r are each 1 or 2) It is a structural part represented by. When k or m is 2 or more, a plurality of Ar may be the same or may be different from each other} It is a structural part indicated by] Epoxy compound, characterized in that it has a molecular structure represented by. |