| abstract |
The present invention is an unsaturated prepared by reacting a maleimide compound (a) having at least two N-substituted maleimide groups in one molecule and an amine compound (b) having at least two primary amino groups in one molecule in an organic solvent. A thermosetting resin composition containing a resin composition (A) having a maleimide group, a thermosetting resin (B) and a modified imidazole compound (C) such as an isocyanate mask imidazole or an epoxy mask imidazole, and a prepreg using the same, an insulation with a support It relates to films, laminates and printed wiring boards. |