| abstract |
Providing a phenolic hydroxyl group-containing compound excellent in heat resistance and flame retardancy in a cured product, a phenol resin containing the same, a curable composition and its cured product, a semiconductor encapsulating material, and a printed wiring board. Structural Formula (I) [Wherein, j and k are each 1 or 2, and at least one of j and k is 2] A dinuclear compound (X) represented by a structural formula (II) [Wherein, l, m, and n are 1 or 2, and at least one of l, m, and n is 2] A phenolic resin comprising a trinuclear compound (Y) represented by an as an essential component. |