abstract |
An object of the present invention is to provide an adhesive composition capable of alleviating thermal stress during a cold heat cycle test having high thermal conductivity and excellent adhesion by controlling the dispersibility of a thermally conductive filler, and (A) a soluble polyimide, ( B) An adhesive composition containing an epoxy resin and (C) a thermally conductive filler, which contains three kinds of diamine residues having a specific structure, and (B) the content of the epoxy resin is (A) 100 parts by weight of soluble polyimide It is an adhesive composition characterized by being 30 parts by weight or more and 100 parts by weight or less. |