| abstract |
An object of the present invention is to obtain a curable composition capable of obtaining a high-precision wafer-level lens having excellent fast-curing property and shape stability during curing, high heat resistance by curing, and high transparency, high refractive index, and low Abbe's optical properties. To provide. The curable composition for wafer level lenses of the present invention is a curable composition comprising an alicyclic epoxy compound (A) having no ester group and a cationic polymerizable compound (B) having an aromatic ring, wherein the alicyclic epoxy compound (A) having no ester group It is characterized by being a compound having at least two epoxidized cyclic olefin groups. |