| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2015-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2020-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102125240-B1 |
| titleOfInvention |
Copper electroplating bath containing compound of reaction product of amine, polyacrylamide and sultone |
| abstract |
The copper electroplating bath contains the reaction product of amine, polyacrylamide and sultone. The reaction product enables a copper electroplating bath that serves as a leveling agent, has a high uniform electrodeposition property, and provides a copper deposit with reduced nodules. |
| priorityDate |
2015-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |