| Predicate |
Object |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate |
2013-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2020-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102125229-B1 |
| titleOfInvention |
Chemical mechanical polishing composition and method |
| abstract |
Chemical mechanical polishing compositions and methods are provided, wherein the rate of low-k dielectric material removal remains stable after polishing of the 110th polished wafer among a plurality of wafers to be polished. |
| priorityDate |
2012-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |