| abstract |
Provided is a negative photosensitive resin composition capable of alkali development capable of obtaining a cured film having a high resolution and a low taper pattern, and having excellent heat resistance and light shielding properties. (A1) a first resin, (A2) a second resin, (C) a photopolymerization initiator and (D) a colorant, wherein the (A1) first resin is (A1-1) polyimide and/or (A1-2) ) Polybenzoxazole, the (A2) second resin is (A2-1) polyimide precursor, (A2-2) polybenzoxazole precursor, (A2-3) polysiloxane, (A2-4) cardo resin, and (A2-5) The content ratio of the (A1) first resin, which is at least one selected from acrylic resins, and accounts for 100% by mass of the total of the (A1) first resin and the (A2) second resin, is 25 It is characterized by being within a range of 90 to 90% by mass. |