http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102114932-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-647 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0753 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 |
| filingDate | 2013-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102114932-B1 |
| titleOfInvention | Light emitting device and package including the device |
| abstract | The light emitting device of the embodiment is a light emitting structure including a first conductivity type semiconductor layer, an active layer disposed under the first conductivity type semiconductor layer and a second conductivity type semiconductor layer disposed under the active layer, and spaced apart from each other in the horizontal direction A sub-mount on which the first and second metal pads are disposed, a first current bump portion disposed between the first conductive semiconductor layer and the first metal pad, and between the second conductive semiconductor layer and the second metal pad And at least one thermal bump portion disposed between at least one of the second current bump portion and the first or second conductivity type semiconductor layer disposed on the sub-mount. |
| priorityDate | 2013-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.