| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-47
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4952
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-28 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 |
| filingDate |
2019-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2020-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102108387-B1 |
| titleOfInvention |
Semiconductor device and manufacturing method of the same |
| abstract |
The present invention relates to a semiconductor device and a method for manufacturing the semiconductor device, and more particularly, a semiconductor device and a semiconductor capable of preventing damage to the uppermost semiconductor chip even if a certain excessive force is applied during the die bonding process or the wire bonding process It relates to a method of manufacturing a device. |
| priorityDate |
2019-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |