http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102107035-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-099 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49894 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09745 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49866 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate | 2014-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102107035-B1 |
| titleOfInvention | Printed circuit board and method of manufacturing the same |
| abstract | The present invention relates to a printed circuit board and its manufacturing method. More specifically, the printed circuit board according to an embodiment of the present invention is an insulating layer including a circuit pattern having a groove formed therein, a metal protective layer formed by filling the groove, formed on the insulating layer, and the circuit pattern And a solder resist layer having an opening exposing a solder bump formed in the opening of the solder resist layer. |
| priorityDate | 2014-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.