| abstract |
In one embodiment, bonding a first die to a first side of an interposer using a first electrical connector, and bonding a second die to a first side of the interposer using a second electrical connector. Bonding, attaching a first dummy die to the first surface of the interposer adjacent to the second die, and sealing the first die, the second die, and the first dummy die and encapsulant, and forming a package structure by singulating the interposer and the first dummy die. |