| abstract |
With respect to the entirety of the epoxy resin composition for sealing semiconductor devices on tablets, (i) the ratio of tablets having a diameter of 0.1 mm or more and less than 2.8 mm and a height of 0.1 mm or more and less than 2.8 mm as measured by sieve using an ASTM standard sieve is 97 weight % Or more, and (ii) when the standard deviation for the diameter is σD and the standard deviation for the height is σH after measuring the diameter and height for 50 of the tablets, respectively, and (iii) ) The tablet is provided with an epoxy resin composition for sealing a semiconductor device on a tablet having a compression density of 1.2 g / mL or more and 1.7 g / mL or less and a semiconductor device sealed using the same. |