| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-005 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-00 |
| filingDate |
2017-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2020-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102097798-B1 |
| titleOfInvention |
Granule type epoxy resin composition for semiconductor encapsulation and semiconductor device encapsulated by using the same |
| abstract |
The present invention is an epoxy resin; Curing agent; Inorganic fillers; And an epoxy resin composition for sealing a granular semiconductor comprising hollow particles having a glass transition temperature of 100 ° C to 160 ° C and a semiconductor device sealed using the same. |
| priorityDate |
2017-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |