http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102096403-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F2001-136295 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-136295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-44 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1362 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-44 |
| filingDate | 2017-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102096403-B1 |
| titleOfInvention | Etching composition |
| abstract | The present invention relates to an etchant composition comprising hydrogen peroxide, an etch inhibitor, a chelating agent, an etch additive, and a peroxide stabilizer, which does not contain a fluorine-based compound and forms a high pH of 4 or higher without using a pH adjusting agent to form a copper film and molybdenum. During the etching process of the containing film, glass substrates and semiconductor structures are prevented from being etched to minimize defects that may occur in the etching process. |
| priorityDate | 2017-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 135.