http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102085547-B1
Outgoing Links
Predicate | Object |
---|---|
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67115 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02118 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6719 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-482 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02337 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02348 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02631 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67103 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02277 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
filingDate | 2014-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2020-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2020-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-102085547-B1 |
titleOfInvention | Uv-assisted photochemical vapor deposition for damaged low k films pore sealing |
abstract | Embodiments of the present invention generally provide methods for sealing pores at the surface of a dielectric layer formed on a substrate. In one embodiment, the method comprises exposing a dielectric layer formed on a substrate to a first pore sealant, wherein the first pore sealant contains a compound of the general formula C x H y O z , wherein x is 1 In the range from 1 to 15, y in the range from 2 to 22, z in the range from 1 to 3, and exposing the substrate to the first layer on the dielectric layer by exposing the substrate to UV radiation in the atmosphere of the first pore sealant. Forming a sealing layer. |
priorityDate | 2013-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 44.