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filingDate 2014-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2020-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-102084033-B1
titleOfInvention Dense composite material, method for producing the same, and component for semiconductor production equipment
abstract An object of the present invention is to provide a composite material having a very small thermal expansion coefficient difference with alumina and sufficiently high thermal conductivity, compactness and strength. The dense composite material of the present invention contains 37% by mass to 60% by mass of silicon carbide particles, contains titanium silicide, titanium silicon carbide and titanium carbide in a smaller amount than mass% of the silicon carbide particles, respectively, and has an open porosity of 1 It is% or less. Characteristics of such a dense composite material are, for example, an average linear thermal expansion coefficient of 7.2 ppm / K to 8.2 ppm / K at 40 ° C to 570 ° C, a thermal conductivity of at least 75 W / mK, and a four-point bending strength of at least 200 MPa.
priorityDate 2013-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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