| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B2203-007 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67276
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B3-024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67051
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B3-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68764
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02052 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-687
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 |
| filingDate |
2018-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2020-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102080987-B1 |
| titleOfInvention |
Substrate processing method and substrate processing apparatus |
| abstract |
A hole is formed in the liquid film of the low surface tension liquid covering the entire upper surface of the substrate, and the center of the upper surface of the substrate is exposed. The hole in the liquid film of the low surface tension liquid is widened to the outer periphery of the substrate. The hot water discharge is stopped before the hole is formed in the liquid film of the low surface tension liquid. After the liquid film of the low surface tension liquid is discharged from the upper surface of the substrate, hot water is again supplied to the lower surface of the substrate. After the discharge of the hot water is stopped, the liquid adhering to the substrate is shaken off. |
| priorityDate |
2017-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |