abstract |
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder cream for an electronic component and a method of manufacturing the same, and relates to a solder cream for an electronic component in which a flux alloy and a solder alloy powder composed of Bi, Cu, Co, Sn residues and other unavoidable impurities are mixed. In addition, according to the present invention, the solder alloy powder and the flux are mixed to simplify the process through creaming, thereby increasing the work efficiency. |