Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0254 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-249974 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-249971 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0243 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C2214-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24893 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4626 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C14-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C23-008 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
filingDate |
2014-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2019-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2019-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-102060088-B1 |
titleOfInvention |
Circuit materials, circuit laminates, and methods of manufacture therof |
abstract |
A circuit subassembly comprising a dielectric substrate layer and a conductive metal layer having a dielectric constant lower than about 3.5 and a loss factor lower than about 0.006 at 10 GHz, wherein the composition of the dielectric substrate layer is a borosilicate microsphere treated with an alkaline solution. A circuit subassembly is disclosed that includes about 5 to about 70 volume percent. |
priorityDate |
2013-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |