| abstract |
Provided are a thermoplastic liquid crystal polymer film capable of suppressing change in relative dielectric constant before and after heating, a laminate using the thermoplastic liquid crystal film, and a circuit board. The said thermoplastic liquid crystal polymer film has a change rate of the dielectric constant (epsilon r2 ) after heating a film with respect to the dielectric constant (epsilon r1 ) before heating a film in the frequency of 1-100 Hz, and the film has a melting point of the film. When it heats for 1 hour in the range of temperature lower than 30 degreeC-10 degreeC higher than melting | fusing point, the following formula (I) is satisfied. | Ε r2 -ε r1 | / ε r1 × 100 ≤ 5 (I) ( Wherein ε r1 is the relative dielectric constant before heating the film, ε r2 is the relative dielectric constant after heating the film, and these relative dielectric constants are measured at the same frequency) |