| abstract |
The present invention provides a polyamideimide film having greatly improved mechanical properties and heat resistance while maintaining the following transparency. The polyamideimide is excellent in transparency, heat resistance, mechanical strength and flexibility, and is a substrate for an element, a cover substrate for display, an optical film, an IC (intergrated circuit) package, an adhesive film, and a multilayer FPC (flexible printed circuit). ), Tapes, touch panels, protective films for optical discs and the like can be used in various fields. |