http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102049588-B1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-00
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filingDate 2015-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2019-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-102049588-B1
titleOfInvention Photo curable adhesive and bonding composition and adhesive film
abstract Acrylic type photocurable resin superposed | polymerized from the mixed monomer component containing a (meth) acrylate monomer and a photoreactive monomer; And a photoinitiator, wherein the (meth) acrylate monomer includes an alkyl (meth) acrylate having a branched alkyl group having 10 to 25 carbon atoms, and the photoreaction initiation amount of the photoreactive monomer starts photoreaction of the photoinitiator. It provides a photocurable adhesive agent composition which is larger than the quantity of light and whose dielectric constant of photocuring is 3.5 or less at the frequency of 100 kHz-2 MHz. The present invention also provides a pressure-sensitive adhesive film comprising a partially cured product of the photocurable adhesive agent composition and having a dielectric constant of 3.5 or less at a frequency of 100 kHz to 2 MHz.
priorityDate 2015-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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