http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102043098-B1

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filingDate 2018-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c788010821deb8ea9f4e8065fd85cb2
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publicationDate 2019-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-102043098-B1
titleOfInvention Device for test socket having conducting fiber and method of manufacturing the same
abstract The method of manufacturing a test socket of the present invention is a method of manufacturing a test socket in which an electrical test is performed by electrically connecting a conductive ball of a semiconductor device and a contact pad of a test device, wherein a first plating layer is formed on a surface or inside of a yarn base material. Providing a first conductive yarn by first sputtering, and installing the first conductive yarn vertically through the hole of the insulated socket body to form a test socket, wherein the first conductive yarn is penetrated through the insulated socket body. And a non-exposed area and an exposed area exposed from the insulated socket body, providing a mask for opening at least the exposed area on the insulated socket body, and second sputtering a second metal layer to provide a third conductive yarn. And a third conductive yarn by electroless plating a third metal layer with the seed layer using the first metal layer and the second metal layer. Providing a step. According to such a structure, the connection section is expanded and the reliability of an electrical test is improved.
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Total number of triples: 41.