http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102036762-B1

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b20bda77d45f8eaec3c02ac134999075
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54433
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73267
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-525
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4334
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3736
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3675
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3672
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3135
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-525
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
filingDate 2019-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_021b09f48ea688f62c0c0013555fed32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_448cd7a349db8234916eae670c4c8448
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a737c1a9a840c80a46da8594dee19ddd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6de3dc5833039121a14993a453304e0e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7cfbce5a50def6f2ea5898c6542ad706
publicationDate 2019-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-102036762-B1
titleOfInvention Semiconductor Package
abstract A semiconductor package according to an exemplary embodiment of the present disclosure includes a semiconductor chip including a chip pad; A redistribution layer electrically connected to the chip pad of the semiconductor chip; An external connection terminal electrically connected to the redistribution layer; A metal frame on the redistribution layer; An encapsulant configured to fix the semiconductor chip and the metal frame onto the redistribution layer; An adhesive film on the encapsulant; And a heat sink fixed on the encapsulant by the adhesive film, wherein the metal frame includes a cavity formed by an inner wall of the metal frame, and the semiconductor chip is positioned in the cavity of the metal frame. Surrounded by the inner wall of the metal frame, wherein the semiconductor chip is spaced apart from the inner wall of the metal frame by 50 micrometers to 150 micrometers, and the encapsulant is provided in a space between the semiconductor chip and the inner wall of the metal frame. The width of the heat sink may be smaller than the width of the adhesive film.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220012207-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110854083-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102578888-B1
priorityDate 2018-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20120077875-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010232471-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004260051-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-19980073899-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID90455
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14775
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559550
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559551
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23992
http://rdf.ncbi.nlm.nih.gov/pubchem/taxonomy/TAXID66387
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419577457
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID449789534
http://rdf.ncbi.nlm.nih.gov/pubchem/anatomy/ANATOMYID66387
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID16217673
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559503
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID935
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID412550040
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID66227

Total number of triples: 73.