Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b20bda77d45f8eaec3c02ac134999075 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-96 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3511 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54433 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54486 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73267 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-525 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4334 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3736 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3675 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3672 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3135 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-525 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
filingDate |
2019-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2019-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_021b09f48ea688f62c0c0013555fed32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_448cd7a349db8234916eae670c4c8448 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a737c1a9a840c80a46da8594dee19ddd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6de3dc5833039121a14993a453304e0e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7cfbce5a50def6f2ea5898c6542ad706 |
publicationDate |
2019-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-102036762-B1 |
titleOfInvention |
Semiconductor Package |
abstract |
A semiconductor package according to an exemplary embodiment of the present disclosure includes a semiconductor chip including a chip pad; A redistribution layer electrically connected to the chip pad of the semiconductor chip; An external connection terminal electrically connected to the redistribution layer; A metal frame on the redistribution layer; An encapsulant configured to fix the semiconductor chip and the metal frame onto the redistribution layer; An adhesive film on the encapsulant; And a heat sink fixed on the encapsulant by the adhesive film, wherein the metal frame includes a cavity formed by an inner wall of the metal frame, and the semiconductor chip is positioned in the cavity of the metal frame. Surrounded by the inner wall of the metal frame, wherein the semiconductor chip is spaced apart from the inner wall of the metal frame by 50 micrometers to 150 micrometers, and the encapsulant is provided in a space between the semiconductor chip and the inner wall of the metal frame. The width of the heat sink may be smaller than the width of the adhesive film. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220012207-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110854083-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102578888-B1 |
priorityDate |
2018-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |