| abstract |
Provided are a circuit connection material having excellent low temperature curability and a method for producing a package using the same. A two-layer structure in which a polyvinyl acetal resin, a cationic polymerizable resin, a cationic polymerization initiator, a first adhesive layer containing conductive particles, a cationic polymerizable resin, and a second adhesive layer containing a cationic polymerization initiator are laminated. Shall be. Thereby, even when it crimp | bonds at low temperature, the high trapping efficiency of electroconductive particle is acquired and low temperature curability is improved. |