| abstract |
A method is disclosed for forming a metal layer with selectively high adhesion on the desired portion (s) on a non-conductive substrate without etching the surface of the non-conductive substrate. The method includes applying a specific photosensitive resin composition onto a non-conductive substrate to form a resin layer in the desired portion (s) of the non-conductive substrate by exposure and development, and then performing pretreatment using an alkaline solution. do. |