http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102035493-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate | 2012-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102035493-B1 |
| titleOfInvention | Plating bath and method |
| abstract | The present invention provides a copper plating bath that deposits copper on the surface of a conductive layer containing a leveling agent that is a reaction product of at least one pyridine compound and at least one epoxide-containing compound. This plating bath deposits a substantially planar copper layer on the substrate surface over the electrolyte concentration range. Copper layer deposition methods using such copper plating baths have also been disclosed. |
| priorityDate | 2011-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 201.