http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102031817-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1632 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6723 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 |
| filingDate | 2012-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102031817-B1 |
| titleOfInvention | Machine suitable for plating a cavity of a semi-conductive or conductive substrate such as a through via structure |
| abstract | The present invention relates to a cavity of a semi-conductive or conductive substrate, such as a through silicon via type structure, a) attaching an insulating dielectric layer in the cavity, b) attaching a barrier layer to diffusion of the fill metal, c) electrodepositing a metal, preferably copper, to fill the cavity, and d) in accordance with a metallization process comprising the step of annealing the substrate, which relates to a metallization machine (1), wherein the wet-treatment of steps a), b) and c) in a chemical bath (B) A series of wet-treatment modules 10-60 configured to perform the treatment and at least one configured to perform annealing step d) of the substrate S such that the machine 1 can complete the entire metallization process of the cavity. It characterized in that it comprises an additional module 70 of. |
| priorityDate | 2011-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.