http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102023363-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-12 |
| filingDate | 2017-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102023363-B1 |
| titleOfInvention | Leveling agent for nickel electrolytic plating and nickel electrolytic plating solution containing the leveling agent |
| abstract | An embodiment of the present invention, when forming a nickel plated film by the electroplating method on a substrate having a curved surface, it is possible to improve the flatness of the nickel plated film to form a nickel plated film having a uniform thickness nickel plating agent for In addition, an electrolytic solution containing nickel ions and an organic additive including a nickel electroplating flattening agent, a brightening agent and a stress releasing agent are used to form a nickel plated film having a uniform thickness by electroplating on a substrate having complex surface bending. Provided is a technique for forming a nickel plating solution. |
| priorityDate | 2016-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 144.