http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102022430-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4064 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0091 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40 |
| filingDate | 2013-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102022430-B1 |
| titleOfInvention | Epoxy resin composite and printed circuit board comprising isolation using the same |
| abstract | Epoxy resin composition according to an embodiment of the present invention comprises an epoxy compound of the following formula including a mesogen structure, a curing agent, an inorganic filler, and an additive for improving the adhesion to the metal, the curing agent is diaminodiphenyl sulfone R 1 to R 14 may each be selected from the group consisting of H, Cl, Br, F, C 1 -C 3 alkyl, C 2 -C 3 alkenes, C 2 -C 3 alkyne, m, n Are 1, 2 or 3 respectively. |
| priorityDate | 2013-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 201.