http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102021424-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-0026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1692 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C30-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 |
| filingDate | 2013-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102021424-B1 |
| titleOfInvention | Composition for forming copper film, method for forming copper film, the copper film, wiring board, and electronic device |
| abstract | (Problem) Provided is a composition for forming a copper film which can easily form a low resistance copper film, and a copper film forming method using the same, to provide a copper film, a wiring board, and a touch panel. (Measures) The composition for copper film formation used for formation of a copper film is at least 1 sort (s) of copper compound chosen from the group which consists of (A) organic acid copper, copper hydroxide, and copper oxide, (B) halogen compound, and (C) It is prepared by containing a reducing agent. A coating film is formed on a board | substrate using this composition for copper film formation, it heats at 200 degrees C or less, a copper film is formed on a board | substrate, and a wiring board is manufactured. Moreover, using the composition for copper film formation, a coating film is formed on the transparent substrate 22 in which the 1st detection electrode 23, the 2nd detection electrode 24, etc. were formed, and the coating film is heated and the lead-out wiring 31 ), And the touch panel 21 is manufactured. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102221910-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160043211-A |
| priorityDate | 2012-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 561.