| abstract |
Even if the mold is enlarged or complicated, a release film which is less likely to cause unevenness in the thickness of the release film when the release film is increased, and a semiconductor device in which deformation of the surface of the resin encapsulation portion is suppressed even if the resin encapsulation portion is enlarged or complicated. Provide a method. Cavity surface 26 of the metal mold | die which seals the semiconductor element (light emitting element 12 etc.) of a semiconductor device (light emitting diode 1 etc.) with curable sealing resin, and forms a resin sealing part (lens part 14 etc.). As a release film 30 arrange | positioned at the inside, the release film 30 whose tensile elasticity modulus at 132 degreeC measured in accordance with JISK7127 is 10-24 Mpa, and peeling force is 0.8 N / 25 mm or less. |