| abstract |
Methods, apparatus, and systems for depositing copper and other metals are provided. In some embodiments, a wafer substrate is provided in the device. The wafer substrate has a surface with field regions and features. The copper layer is plated on the surface of the wafer substrate. The copper layer is annealed to redistribute the copper from the region of the wafer substrate to the features. Embodiments of the disclosed method, apparatus, and system allow for the formation of void-free and barter-up features on a wafer substrate. |