| abstract |
The present invention Board; An electrically conductive multilayer stack on the substrate; And 5-10 mil thick coating on electrically conductive multilayer stack As a coated substrate comprising: The coating comprises an antistatic conductive tiecoat on an electrically conductive multilayer stack and an antistatic conductive topcoat on the antistatic conductive tiecoat, Wherein the antistatic conductive tiecoat is formed from a coating composition comprising a hydrophobic first aliphatic polyisocyanate, a second aliphatic polyisocyanate comprising a hydrophilic portion, a polyester polyol, a hydrophilic polyol, and a fluorinated polyol It relates to a coated substrate. |