Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8d9573860531bc7cfc4c7a1000a4ed11 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-0026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-0036 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-02 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 |
filingDate |
2018-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2019-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4cb5f9091f0c10436bd0e6946d34e496 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b17bc78058a8e2bf9faffce046333fc4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5e2b4be6c7d9113e63cbcac8bbf4b5c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_314c990529c0fa5625316be2af97364a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d71ee5036b2617535172ac94216db3e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c821b68aabf7cc2ed32bda212a86350 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a790e244bf78609cb49d10f85f9b4889 |
publicationDate |
2019-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-102009424-B1 |
titleOfInvention |
Manufacturing method of flexible transparent copper films having ultra-high conductivity and the copper films made therefrom |
abstract |
The present invention coats the ink (Ink) in which the nano-silver particles are dispersed on a desired base film to form a silver pattern, and the clear resin coating (Clear resin coating) on the silver pattern, the silver After coating so that only the protruding upper layer of the silver pattern is exposed to the outside, the copper is electroplated onto the silver pattern, thereby pure copper centered on the upper layer of the exposed silver pattern. (Copper) is made of a transparent thin film is formed, and the ultra-high conductivity flexible transparent copper film manufacturing method and copper film prepared therefrom completed by separating the transparent thin film formed in a silver pattern (Silver Pattern) It is about. |
priorityDate |
2018-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |