http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102009424-B1

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filingDate 2018-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4cb5f9091f0c10436bd0e6946d34e496
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publicationDate 2019-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-102009424-B1
titleOfInvention Manufacturing method of flexible transparent copper films having ultra-high conductivity and the copper films made therefrom
abstract The present invention coats the ink (Ink) in which the nano-silver particles are dispersed on a desired base film to form a silver pattern, and the clear resin coating (Clear resin coating) on the silver pattern, the silver After coating so that only the protruding upper layer of the silver pattern is exposed to the outside, the copper is electroplated onto the silver pattern, thereby pure copper centered on the upper layer of the exposed silver pattern. (Copper) is made of a transparent thin film is formed, and the ultra-high conductivity flexible transparent copper film manufacturing method and copper film prepared therefrom completed by separating the transparent thin film formed in a silver pattern (Silver Pattern) It is about.
priorityDate 2018-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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