http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102008882-B1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-60
filingDate 2013-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2019-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-102008882-B1
titleOfInvention Cleaning solution composition for dicing a wafer
abstract The present invention relates to a cleaning composition for wafer dicing, and more particularly, to a polymer compound comprising at least one selected from the group consisting of an EO-PO copolymer compound represented by the formula (1), an acrylic acid polymer, and a salt thereof, isothia By including a zolinone compound and a solvent, the weight-average molecular weight of the EO-PO copolymer compound satisfies 1,000 to 10,000, thereby significantly reducing the generation of bubbles to prevent defects of the detergent spraying device during the dicing process, A cleaning composition for wafer dicing which suppresses formation and pad corrosion and has excellent cleaning ability.
priorityDate 2013-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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