http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102003806-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-06 |
| filingDate | 2013-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102003806-B1 |
| titleOfInvention | Silicone structure-bearing polymer, resin composition, and photo-curable dry film |
| abstract | The present invention relates to a resin comprising a silicon skeleton having a cross-linking group or a cross-linking reaction point in a molecule, wherein the skeleton of isocyanuric acid is bonded to a molecular or terminal group and a silicone skeleton having a weight average molecular weight of 3,000 to 500,000 Containing polymer compound. According to the present invention, it is possible to dramatically improve the peeling problem encountered on a metal wiring such as Cu or Al, an electrode, a substrate, or a substrate such as SiN, to form a fine pattern in a wide wavelength region, In addition, it is possible to provide a chemically amplified negative resist material, a photocurable dry film, and a pattern forming method using the chemically amplified negative resist material, which is useful for coatings for electric and electronic parts protection, capable of miniaturizing a pattern in rewiring technology in accordance with high density and high integration of chips . |
| priorityDate | 2012-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 418.