http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102000006-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-10 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-488 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488 |
| filingDate | 2013-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102000006-B1 |
| titleOfInvention | Thermosetting resin composition |
| abstract | The thermosetting resin composition of the present invention is a thermosetting resin composition for use in a film-forming step, a resin composition adhering step, a mounting step and a reflow step, which comprises an epoxy resin, an organic acid and a thixotropic agent, The epoxy resin is characterized by containing a dimeric acid type epoxy resin. |
| priorityDate | 2012-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 62.