| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2355-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2369-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1641
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1603
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 |
| filingDate |
2017-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2019-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101994910-B1 |
| titleOfInvention |
Shielding coating for selective metallization |
| abstract |
The shielding coating is applied to the polymer substrate for selective metallization of the substrate. The shielding coating comprises a primer component and a hydrophobic topcoat. The primer is first applied to the polymer substrate followed by the application of the topcoat component. The shielding coating is then selectively etched to form an outline of the desired current pattern. A catalyst is applied to the patterned polymer substrate followed by electroless metal plating on the etched portions. The portion of the polymer substrate containing the shielding coating inhibits electroless metal plating. The primer contains an aromatic heterocyclic compound and the top coat contains a hydrophobic alkyl organic compound. |
| priorityDate |
2016-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |