http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101986763-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0757 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0226 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028 |
| filingDate | 2012-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101986763-B1 |
| titleOfInvention | Negative-type photosensitive resin composition having high thermal stability and high resolution, and hardened overcoat layer prepared therefrom |
| abstract | The present invention relates to a high heat-resistant, high-resolution negative-working photosensitive resin composition comprising an organosiloxane polymer and an acrylic copolymer simultaneously, and a cured film prepared therefrom, comprising: (1) an organosiloxane polymer; (2) a structural unit derived from (2-1) an ethylenically unsaturated carboxylic acid, an ethylenically unsaturated carboxylic acid anhydride, or a mixture thereof, and (2-2) a structural unit derived from an aromatic ring-containing ethylenically unsaturated compound Random copolymers; (3) an acrylate-based compound having at least one ethylenically unsaturated double bond; And (4) a photopolymerization initiator, wherein the organosiloxane polymer comprises a siloxane unit (a) having a (meth) acrylate group as a polymerized unit, and is selected from the group consisting of an epoxy group, an oxetane group, a hydroxyl group and a thiol group (B) having at least one functional group selected from the group consisting of a C 1 -C 9 alkyl group, a C 3 -C 14 cycloalkyl group, a C 6 -C 14 aryl group, a C 7 -C 14 alkylaryl group and a C 7 -C 14 arylalkyl group (C) a siloxane unit having at least one group selected from the group consisting of (a) and (b), wherein the siloxane unit having two functional groups is at least 0.7 And a random copolymer of the organosiloxane polymer and the random copolymer in a weight ratio of 99: 1 to 20:80. The cured film produced from the photosensitive resin composition of the present invention has a pattern developing property, a surface hardness, a heat resistance, Light As a protective film, etc. for electronic parts get excellent properties in terms of crack gwayul and sex can be useful. |
| priorityDate | 2012-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 133.