| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2006-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2006-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2004-82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2004-64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2002-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2002-77 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01F17-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B33-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B33-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B33-1417
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B33-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B33-149
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01F17-0043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01F17-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1454
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01F17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01B33-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01B33-14 |
| filingDate |
2016-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2019-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101983755-B1 |
| titleOfInvention |
Silica-based composite fine-particle dispersion, method for producing same, and polishing slurry including silica-based composite fine-particle dispersion |
| abstract |
The object of the present invention is to provide a semiconductor device such as a semiconductor substrate wiring board and the like, which can polish a silica film, a Si wafer and a hardly processed material at a high speed and at the same time does not contain impurities capable of achieving high surface accuracy Based composite fine particle dispersion which can be preferably used for surface polishing of a silica-based composite fine particle. The object of the present invention is to provide a silica-based composite fine particle having a silica coating on its surface, the base particles comprising amorphous silica as a main component, the silica particles having a crystalline ceria as a main component bonded to the surface thereof, Based composite fine particle dispersion. The mass ratio of the parent particle to the child particle is within a specific range. Provided in X-ray diffraction, only the crystal phase of ceria is searched. The crystallite diameter of the (111) plane (near 2? = 28 degrees) of the crystalline ceria is in a specific range. The content of Na is low. The ratio of the number% of Si atoms to the number% of Ce atoms of the silica coating is a specific range. |
| priorityDate |
2015-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |