http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101980949-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2016-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101980949-B1 |
| titleOfInvention | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same |
| abstract | The present invention relates to an epoxy resin composition for encapsulating a semiconductor device comprising an epoxy resin, a curing agent and an inorganic filler containing a compound represented by the following general formula (1), and a semiconductor device sealed using the epoxy resin composition. [Chemical Formula 1] In Formula 1, A represents an aromatic ring group; X is O or N atom; R is hydrogen, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 30 carbon atoms, an allyl group, an epoxy group, a glycidyl group or an acrylic group; m1 and m2 are each independently an integer of 1 to 5; n is an integer of 0 to 20; |
| priorityDate | 2016-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 109.