http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101974687-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06 |
| filingDate | 2015-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101974687-B1 |
| titleOfInvention | Surface-treated copper foil and laminate |
| abstract | [PROBLEMS] To provide a technique for improving mounting workability when mounting an electronic component or the like on a flexible printed wiring board. A surface-treated copper foil comprising a copper foil base material, a copper plating layer formed on the copper foil base material, and a copper-clad coating layer formed on the copper plating layer, characterized in that the surface-treated copper foil is opposed to the copper- When the surface-treated copper foil is removed on both major surfaces of the resin substrate after bonding the surface-treated copper foil so that the side of the resin substrate is in contact with the resin substrate, the resin substrate has a haze value of 80% or less and a transparency of 70% , And the fill strength between the surface-treated copper foil and the resin base material is 0.6 N / mm or more. |
| priorityDate | 2014-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.