http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101969197-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0226 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 |
| filingDate | 2012-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101969197-B1 |
| titleOfInvention | Positive photosensitive resin composition |
| abstract | (a) an alkali-soluble polyimide, (b) a compound having two or more epoxy groups in one molecule, and (c) a photoacid generator, wherein (a) 100 parts by weight of the alkali- And the content of the compound having two or more epoxy groups is 5 to 50 parts by weight. The present invention provides a positive photosensitive resin composition capable of obtaining a cured film of high resolution which does not cause pattern embedding due to reflow while being low in bending at a low temperature of 200 ° C or less. |
| priorityDate | 2012-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 195.